The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Jan. 18, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Yun Cheng, Hsinchu, TW;

Kenichi Sano, Hsinchu, TW;

Yu-Wei Lu, Hsinchu, TW;

Yi-Chen Lo, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01); B25J 15/10 (2006.01); H01J 37/20 (2006.01); H01J 37/317 (2006.01); H10P 30/40 (2026.01); H10P 50/28 (2026.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7624 (2026.01); B25J 15/10 (2013.01); H01J 37/20 (2013.01); H01J 37/3171 (2013.01); H10P 30/40 (2026.01); H10P 50/283 (2026.01); H10P 72/72 (2026.01); H01J 2237/0203 (2013.01); H01J 2237/2007 (2013.01);
Abstract

An apparatus includes a supporting frame, a platform supported by the supporting frame and having a first side and a second side opposite to the first side, and at least three robot fingers which are mounted to the supporting frame, and which are angularly displaced from each other. Each of the robot fingers has a fingertip configured to retain a substrate on the first side of the platform such that the substrate is spaced apart from the platform. A method for manufacturing a semiconductor structure using the apparatus is also disclosed.


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