The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Jun. 20, 2023
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Gregor Langer, Wölfnitz, AT;

Bernhard Goller, Villach, AT;

Nilesha Mishra, Villach, AT;

Matteo Piccin, Villach, AT;

Franz-Josef Pichler, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/3043 (2013.01); H01L 22/14 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method of manufacturing a semiconductor device in a semiconductor body is proposed. The method includes processing a semiconductor body at a first surface of the semiconductor body. The method further includes attaching the semiconductor body to a carrier via the first surface. The carrier includes an inner part and an outer part at least partly surrounding the inner part. The method further includes processing the semiconductor body at a second surface opposite to the first surface. The method further includes detaching the inner part of the carrier from the semiconductor body.


Find Patent Forward Citations

Loading…