The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Jan. 25, 2022
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Satoru Matsukura, Tokyo, JP;

Yoshito Kamaji, Hsinchu, TW;

Nanako Tamari, Tokyo, JP;

Akira Kagoshima, Tokyo, JP;

Masahiro Sumiya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); G05B 19/418 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32926 (2013.01); H01J 37/32935 (2013.01); H10P 72/0604 (2026.01);
Abstract

An apparatus diagnostic apparatus that performs a computation process using data acquired from a semiconductor apparatus manufacturing apparatus having a reference chamber to create reference chamber feature quantity map data by mapping a feature quantity onto a graph having axes representing a plurality of parameters. The apparatus diagnostic apparatus also performs a computation process using data acquired from a semiconductor apparatus manufacturing apparatus having a calibration-target chamber to create calibration-target chamber feature quantity map data by mapping a feature quantity onto a graph having axes representing a plurality of parameters. Based on patterns observed in the reference chamber feature quantity map data and the calibration-target chamber feature quantity map data, the apparatus diagnostic apparatus identifies a performance difference between different chambers, a performance difference resulting from a temporal change of a single chamber, or a performance difference resulting from component replacement or component cleaning of a single chamber.


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