Memory device and repair method of the memory device

Abstract

A memory device is provided. The memory device includes: a first cell region provided in a first layer and including a first bit line and a first redundant bit line; a second cell region provided in a second layer and including a second bit line and a second redundant bit line; a peripheral region provided in a third layer and including first page buffers configured to be respectively connected to the first bit line and the second bit line, and a second page buffer configured to be commonly connected to the first redundant bit line and the second redundant bit line; and a control circuit configured to: based on the first bit line being defective, replace the first bit line with the first redundant bit line; and based on the second bit line being defective, replace the second bit line with the second redundant bit line.