The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Jun. 26, 2024
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Fatma Arzum Simsek-Ege, Boise, ID (US);

Haitao Liu, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/04 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01); G11C 11/4097 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
G11C 11/4085 (2013.01); G11C 11/4091 (2013.01); G11C 11/4097 (2013.01); H10B 12/315 (2023.02); H10B 12/482 (2023.02); H10B 12/485 (2023.02); H10B 12/50 (2023.02);
Abstract

A microelectronic device includes a first die and a second die vertically overlying and attached to the first die. The first die includes an array region and a peripheral region horizontally neighboring the array region. The array region includes memory cells respectively including a first transistor structure, a second transistor structure horizontally neighboring the first transistor structure, and a storage device vertically underlying and coupled to the first transistor structure and the second transistor structure. The peripheral region includes sub word line driver circuitry. The second die includes sense amplifier regions and a CMOS region horizontally neighboring some of the sense amplifier regions. The sense amplifier regions are within a horizontal area of the array region of the first die and include sense amplifier circuitry. Related memory devices and electronic systems are provided.


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