The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Feb. 02, 2024
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung City, TW;

Inventors:

Shuai-Lin Liu, Taichung City, TW;

Nai-Hao Kao, Taichung City, TW;

Yu-PO Wang, Taichung City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/43 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/12002 (2013.01); G02B 6/12004 (2013.01);
Abstract

An electronic package and a manufacturing method thereof are provided, in which a first optoelectronic element having a first optical fiber connection portion is disposed on an electronic module, a second optoelectronic element having a second optical fiber connection portion is disposed on a first level layer of a lower carrying portion of a step-shaped carrier structure, and the electronic module is disposed on a second level layer of the step-shaped carrier structure and the second optoelectronic element having the second optical fiber connection portion, so that the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connection portion. Thereby, two optoelectronic elements having optical fiber connection portions can be easily and vertically integrated, and the second optoelectronic element can be stably carried by the step-shaped carrier structure.


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