The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Nov. 09, 2022
Applicants:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Universal Scientific Industrial (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Yi-Hung Hou, Kaohsiung, TW;

Yung-Fa Chen, Nantou County, TW;

Sheng-Chia Chen, Nantou County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/40 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/421 (2026.01); H10W 70/442 (2026.01); H10W 70/461 (2026.01); H10W 90/811 (2026.01); H10W 70/417 (2026.01); H10W 72/884 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract

An electronic device is disclosed. The electronic device includes a first conductive plate and a first electronic component. The first conductive plate includes a first connecting portion. The first electronic component supports the first conductive plate through the first connecting portion. The first connecting portion is electrically connected to the first electronic component and configured to buffer stress from the first conductive plate to the first electronic component.


Find Patent Forward Citations

Hou, Yi-Hung. (2026). Electronic device (U.S. Patent No. 12648484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12648484

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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