The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
May. 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Tzu-Wei Yu, Hsinchu, TW;
Ching-Hung Wang, Hsinchu, TW;
Yeong-Jyh Lin, Caotun Township, TW;
Ching I Li, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A bag is filled with liquid, instead of an airbag filled with gas, to deform a bottom wafer toward a top wafer during a wafer bonding process. As a result, the liquid is less susceptible to temperature changes, which reduces run-out variation across wafer bonding processes. Reducing run-out variation conserves wasted wafers by increasing yield and reducing a quantity of non-functioning devices that are produced. Additionally, in some implementations, the liquid may be pre-heated before the bag is filled with the liquid. As a result, the bottom wafer (and, to some extent, the top wafer) experiences some thermal deformation and less mechanical deformation, which further increases yield and reduces a quantity of non-functioning devices that are produced.