Substrate transfer method and semiconductor manufacturing system

Abstract

A semiconductor manufacturing system includes a plurality of transfer modules, a pass module, and one or more process modules. In a substrate transfer method, a transfer robot is controlled to transfer a substrate from one of the transfer modules to a process module connected to the other transfer module via a pass module. In the substrate transfer method, when a plurality of substrates are transferred, it is determined whether to perform one-by-one correction in which positions of a plurality of substrates are corrected on a one-by-one basis and placed on a plurality of stages of the pass module, or to perform average correction in which an average value of positions of a plurality of substrates with respect to the plurality of stages is obtained and the plurality of substrates are placed collectively.