The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Dec. 21, 2022
Applicant:

Entegris, Inc., Billerica, MA (US);

Inventors:

Zhifeng Li, Acton, MA (US);

Pushkara Rao Varanasi, Poughkeepsie, NY (US);

Michael C. Zabka, New Prague, MN (US);

Assignee:

Entegris, Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); C09D 5/24 (2006.01); H10P 72/10 (2026.01);
U.S. Cl.
CPC ...
H10P 72/1928 (2026.01); C09D 5/24 (2013.01); H10P 72/1911 (2026.01); H10P 72/1922 (2026.01);
Abstract

A semiconductor processing apparatus including: a substrate comprising a polymer material layer; and a conductive polymer coating layer that coats at least a portion of the polymer material layer of the substrate, wherein the conductive polymer coating layer comprises conjugated polymers, wherein the conductive polymer coating layer has a total extractable metals less than 400 ng/g, and wherein the conductive polymer coating layer is configured to discharge electrostatic buildup in the semiconductor processing apparatus when connected to a semiconductor processing system.


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