The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Mar. 20, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Son Nguyen, Schenectady, NY (US);

Ashim Dutta, Clifton Park, NY (US);

Rudy J. Wojtecki, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 50/80 (2023.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01); H10N 50/20 (2023.01);
U.S. Cl.
CPC ...
H10N 50/80 (2023.02); H10B 61/00 (2023.02); H10N 50/01 (2023.02); H10N 50/20 (2023.02);
Abstract

A semiconductor device including a magnetic tunnel junction (MTJ) stack, a dielectric encapsulation layer surrounding vertical side surfaces of the MTJ stack, a metal encapsulation layer surrounding an upper horizontal surface and a portion of a vertical side surface of the dielectric encapsulation layer, and a dielectric surrounding a remaining portion of the vertical side surface of the dielectric encapsulation layer. A method including method includes forming a magnetic tunnel junction (MTJ) stack, forming a dielectric encapsulation layer surrounding vertical side surfaces of a top electrode, a free layer, a tunneling barrier, a reference layer and a bottom electrode of the MTJ stack, and forming a metal encapsulation layer surrounding an upper horizontal surface and a portion of a vertical side surface of the dielectric encapsulation layer.


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