The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Aug. 11, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Min Suet Lim, Gelugor, MY;

George Vergis, Portland, OR (US);

Stephen P. Christianson, Tigard, OR (US);

Ankita Tiwari, Sunnyvale, CA (US);

Virendra Vikramsinh Adsure, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/32 (2019.01); G06F 1/3234 (2019.01);
U.S. Cl.
CPC ...
G06F 1/3275 (2013.01);
Abstract

Apparatus, assemblies, and platforms employing modular power voltage regulator (VR) modules to provide power to memory modules. A power VR module includes VR circuitry integrated on or coupled to a substrate with wiring coupling the VR circuitry to connector elements in first and second connector means. An assembly further includes a pair of memory modules (e.g., DDR) that are coupled to a power VR module via mating connector means. The connector means may be coupled using a Compression Mount Technology (CMT) connector disposed between arrays of CMT contact pads on the power VR module and the memory modules, or may comprise BGAs, PGAs, and LGAs. The power VR module receives one or more input voltages via one or both memory module and provide various output voltages to each of the memory modules to power memory devices and other circuitry on those modules.


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