The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Jun. 15, 2023
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Tatsuya Yamaguchi, Tokyo, JP;
Yutaka Sasaki, Iwate, JP;
Makoto Takahashi, Iwate, JP;
Toru Ishii, Iwate, JP;
Naoshige Fushimi, Yamanashi, JP;
Koji Yoshii, Iwate, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/46 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01); H10P 14/60 (2026.01); H10P 14/694 (2026.01);
U.S. Cl.
CPC ...
C23C 16/466 (2013.01); C23C 16/345 (2013.01); C23C 16/45544 (2013.01); C23C 16/4584 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); H01J 37/3244 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H10P 14/6339 (2026.01); H10P 14/69433 (2026.01);
Abstract
A substrate processing apparatus includes: a processing container that accommodates a substrate; a processing gas supply that supplies a processing gas into the processing container; an exhaust that exhausts an inside of the processing container; a heater that heats the processing container; and a cooling gas injector that injects a cooling gas for cooling the substrate.