The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Oct. 10, 2023
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Inventors:
Shaun Bowers, Gilbert, AZ (US);
Bora Baloglu, Oporto, PT;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 76/15 (2026.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 72/00 (2026.01); H10W 76/01 (2026.01); H10W 76/60 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 76/15 (2026.01); H10W 70/093 (2026.01); H10W 70/095 (2026.01); H10W 70/635 (2026.01); H10W 72/071 (2026.01); H10W 76/01 (2026.01); H10W 76/60 (2026.01); H10W 90/701 (2026.01);
Abstract
In one example, a semiconductor device comprises a substrate comprising a conductive structure, an electronic component over a top side of the substrate and electrically coupled with the conductive structure, a lid structure over the substrate and over the electronic component, and a vertical interconnect in the lid structure extending to a top surface of the lid structure and electrically coupled with the conductive structure. Other examples and related methods are also disclosed herein.