The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Nov. 03, 2022
Applicant:

Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);

Inventor:

Belgacem Haba, Saratoga, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H10W 70/63 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 90/20 (2026.01); H10W 90/22 (2026.01);
U.S. Cl.
CPC ...
H10W 70/635 (2026.01); H10W 90/00 (2026.01); H10W 72/07354 (2026.01); H10W 72/347 (2026.01); H10W 90/22 (2026.01); H10W 90/297 (2026.01); H10W 90/732 (2026.01); H10W 90/734 (2026.01); H10W 90/792 (2026.01);
Abstract

A stacked electronic device is disclosed. The stacked electronic device can comprise a first stacked assembly including a first plurality of integrated device dies. The first plurality of integrated device dies can comprise a first integrated device die. A second stacked assembly is disposed over the first stacked assembly. The second stacked assembly includes a second plurality of device dies, and the second plurality of device dies can comprise a second integrated device die. A first channel can extend at least partially through the first stacked assembly. The first integrated device die can comprise a first circuit, and the first channel is connected to the first circuit. A second channel can extend through and bypass the first stacked assembly, the second channel extending at least partially through the second stacked assembly. The second integrated device die can comprise a second circuit, and the second channel is connected to the second circuit.


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