Semiconductor package, base station, mobile device and method for forming a semiconductor package

Abstract

A semiconductor package is provided. The semiconductor package includes a semiconductor die arranged within a housing of the semiconductor package. The semiconductor die holds a radio frequency circuit and a plurality of first electrical contacts. Additionally, the semiconductor package includes a plurality of second electrical contacts formed on the exterior of the housing to enable external electrical contacting of the semiconductor package. The semiconductor package further includes a plurality of transmission lines formed in or on a substrate of the semiconductor package. Each of the plurality of transmission lines couples a respective one of the plurality of first electrical contacts with a respective one of the plurality of second electrical contacts. At least one of the plurality of transmission lines is formed as a stepped transmission line transformer comprising a plurality of transmission line segments exhibiting different impedances to match a respective first impedance of the respectively coupled first electrical contact to a respective second impedance at the respectively coupled second electrical contact. The plurality of transmission line segments exhibit different spacings to one or more ground plane of the semiconductor package.