The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Aug. 17, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Atsushi Ogino, Fishkill, NY (US);

Baozhen Li, South Burlington, VT (US);

Dureseti Chidambarrao, Weston, CT (US);

Matthew Stephen Angyal, Stormville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/40 (2026.01); H10D 1/68 (2025.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/496 (2026.01); H10D 1/692 (2025.01); H10W 20/056 (2026.01); H10W 20/42 (2026.01);
Abstract

A semiconductor device including a metal insulator metal capacitor (MIM capacitor), a first via connected to and through a bottom plate of the MIM, and a middle plate of the MIM, where a middle isolated portion of the middle plate of the MIM surrounds the first via. A MIM capacitor, a first via connected to and through a bottom plate of the MIM, and a middle plate of the MIM, where a middle isolated portion of the middle plate of the MIM surrounds the first via, where the middle isolated portion is surrounded by a middle isolation dielectric on all vertical side surfaces. Forming a MIM capacitor, forming a first via connected to and through a bottom plate of the MIM, and forming a middle plate of the MIM, where a middle isolated portion of the middle plate of the MIM surrounds the first via.


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