The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Feb. 22, 2023
Applicant:
Tes Co., Ltd, Yongin-si, KR;
Inventors:
Hyeong-Wook Moon, Yongin-si, KR;
Bong-Soo Kwon, Yongin-si, KR;
Se-Woong Bae, Yongin-si, KR;
Eun-Jin Song, Yongin-si, KR;
Assignee:
TES CO., LTD, Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 70/00 (2026.01); H01J 37/32 (2006.01); H10P 50/28 (2026.01);
U.S. Cl.
CPC ...
H10P 70/23 (2026.01); H01J 37/32357 (2013.01); H01J 37/32871 (2013.01); H10P 50/285 (2026.01); H01J 2237/3341 (2013.01); H01J 2237/335 (2013.01);
Abstract
A substrate treating method for removing a dielectric by-product produced by etching a dielectric film formed on a substrate, includes: providing a gaseous boron compound into a reaction chamber to remove the dielectric by-product; and purging an inside of the reaction chamber. The boron compound is represented by BX, where X is hydrogen, alkyl, amino, or halogen, and n is a natural number greater than or equal to 1.