The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Jun. 08, 2021
Applicant:
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Inventor:
Junya Ishizaki, Takasaki, JP;
Assignee:
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/82 (2025.01); H10F 71/00 (2025.01); H10F 77/70 (2025.01); H10H 20/01 (2025.01); H10H 20/80 (2025.01); H10H 20/84 (2025.01); H10H 20/854 (2025.01); H10P 10/00 (2026.01); H10P 50/64 (2026.01);
U.S. Cl.
CPC ...
H10H 20/82 (2025.01); H10F 71/1272 (2025.01); H10F 71/1276 (2025.01); H10F 77/703 (2025.01); H10F 77/707 (2025.01); H10H 20/018 (2025.01); H10H 20/84 (2025.01); H10H 20/854 (2025.01); H10P 10/126 (2026.01); H10H 20/872 (2025.01); H10P 50/646 (2026.01);
Abstract
A bonded semiconductor device including an epitaxial layer, and a support substrate made of a material different from that of the epitaxial layer and bonded to the epitaxial layer. Any one of the epitaxial layer and the support substrate has a bonding surface with a radial pattern including recesses or protrusions radially spreading from a certain point on the bonding surface as a center.