Solid-state imaging device, package, and imaging system

Abstract

The present disclosure relates to a solid-state imaging device, a package, and an imaging system capable of curbing degradation of image quality. A solid-state imaging device according to an aspect of the present technology includes a photoelectric conversion unit comprising a material with lower band gap energy than silicon, and a circuit substrate that is joined to the photoelectric conversion unit, in which the circuit substrate includes a pixel signal generation circuit that generates a pixel signal of a voltage value in accordance with a charge generated by the photoelectric conversion unit, a thermometer circuit that detects a temperature of the circuit substrate, and a temperature control signal generation circuit that acquires temperature information indicating the temperature detected by the thermometer circuit and generates a temperature control signal on the basis of the acquired temperature information.