The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
May. 30, 2023
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Han-Chee Yen, Taipei City, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H10W 44/20 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/29 (2026.01); H10W 72/59 (2026.01); H10W 72/90 (2026.01); H10W 74/00 (2026.01); H10W 74/01 (2026.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H10W 44/20 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 44/248 (2026.01); H10W 72/0198 (2026.01); H10W 72/29 (2026.01); H10W 72/59 (2026.01); H10W 72/877 (2026.01); H10W 72/879 (2026.01); H10W 72/90 (2026.01); H10W 74/00 (2026.01); H10W 74/014 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01); H10W 90/754 (2026.01);
Abstract
A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.