The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Nov. 30, 2023
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Smit Kapila, Bangalore, IN;

Jithin Valappilekandy, Bangalore, IN;

Sean J.W. Lawrence, Bangalore, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/87 (2013.01);
U.S. Cl.
CPC ...
G06F 21/87 (2013.01);
Abstract

An apparatus includes a circuit board configured for attachment to a cover by a first fastener. The circuit board includes a first via sized to receive a distal portion of a first shaft of the first fastener. A first upper portion of the first shaft is to be received in a through-hole in the cover. The apparatus further includes a first conductive trace extending from a first side wall defining the first via to first circuitry. The first conductive trace is configured to carry one or more input signals to the first circuitry indicating whether the distal portion of the first shaft is at least partially disposed in the first via and communicatively coupled to a first conductive element associated with the first via. The first conductive element may include a first conductive plating at least partially covering the first side wall defining the first via.


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