The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Jul. 06, 2020
Applicant:

Rambus Inc., San Jose, CA (US);

Inventors:

Mark D. Kellam, Siler City, NC (US);

Steven C. Woo, Saratoga, CA (US);

Thomas Vogelsang, Mountain View, CA (US);

John Eric Linstadt, Palo Alto, CA (US);

Assignee:

Rambus Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G06F 15/80 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0656 (2013.01); G06F 3/0604 (2013.01); G06F 3/0673 (2013.01); G06F 15/80 (2013.01);
Abstract

An integrated circuit that includes a set of one or more logic layers that are, when the integrated circuit is stacked in an assembly with the set of stacked memory devices, electrically coupled to a set of stacked memory devices. The set of one or more logic layers include a coupled chain of processing elements. The processing elements in the coupled chain may independently compute partial results as functions of data received, store partial results, and pass partial results directly to a next processing element in the coupled chain of processing elements. The processing elements in the chains may include interfaces that allow direct access to memory banks on one or more DRAMs in the stack. These interfaces may access DRAM memory banks via TSVs that are not used for global I/O. These interfaces allow the processing elements to have more direct access to the data in the DRAM.


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