The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Aug. 01, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seunghyun Cho, Cheonan-si, KR;
Kwanjai Lee, Yongin-si, KR;
Jae-Min Jung, Seoul, KR;
Jeong-Kyu Ha, Hwaseong-si, KR;
Sang-UK Han, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a base film having a first mount section, a first folding section, a second folding section, and a second mount section. A first semiconductor chip is disposed on the first mount section of the base film. A second semiconductor chip is disposed on the second mount section of the base film. Test pads are disposed on the first or second folding sections of the base film and is connected to each of the first and second semiconductor chips. Connection pads are disposed on the first or second mount sections of the base film and are connected to each of the first and second semiconductor chips. The first and second folding sections vertically overlap each other. The test pads are interposed between and buried by the first and second folding sections.