The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Jul. 20, 2022
Applicant:
G-fun Industrial Corporation, Taoyuan City, TW;
Inventors:
Kuo-Chin Chen, Taoyuan City, TW;
Chiu-Hsiung Tsai, Taoyuan City, TW;
Chun-Jen Niu, Taoyuan City, TW;
Li-Hsun Chang, Taoyuan City, TW;
Assignee:
G-FUN INDUSTRIAL CORPORATION, Taoyuan City, TW;
Primary Examiner:
Int. Cl.
CPC ...
D06N 3/18 (2006.01); C08J 5/18 (2006.01); D06N 3/00 (2006.01); D06N 3/04 (2006.01); D06N 3/12 (2006.01);
U.S. Cl.
CPC ...
D06N 3/183 (2013.01); C08J 5/18 (2013.01); D06N 3/0006 (2013.01); D06N 3/0034 (2013.01); D06N 3/0036 (2013.01); D06N 3/0059 (2013.01); D06N 3/0095 (2013.01); D06N 3/047 (2013.01); D06N 3/128 (2013.01); C08J 2375/04 (2013.01); D06N 2201/0263 (2013.01); D06N 2203/044 (2013.01); D06N 2203/066 (2013.01); D06N 2209/128 (2013.01);
Abstract
A composite structure, a resin film, and a method of manufacturing the resin film are provided. The composite structure includes a release carrier and a resin film. The release carrier includes a release substrate and a release resin layer that is formed on the release substrate. The release resin layer covers the release substrate at a coverage rate of between 60% and 100%. The resin film is formed on the release carrier. The resin film is bonded to each of the release substrate and the release resin layer.