The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jun. 22, 2021
Applicant:
Yamaha Robotics Co., Ltd., Tokyo, JP;
Inventor:
Kiyotaka Tanaka, Tokyo, JP;
Assignee:
Yamaha Robotics Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 2224/78901 (2013.01); H01L 2224/85047 (2013.01); H01L 2224/85051 (2013.01);
Abstract
A bump-forming device includes a bonding tool and a bonding controller. The bonding controller is configured to execute a crimping step, a delivery step, a pressing step, and a cutting step, and of the trajectories of the bonding tool, at least the trajectory in the delivery step is determined on the basis of a first parameter relating to a wire (w) and a second parameter relating to the shape of the bonding tool.