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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12635502 B1

PDFFull Text
Date of Patent:
May. 19, 2026

Filed:

Feb. 25, 2022

Dummy pattern structure for reducing dishing

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Jen-Yuan Chang, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

KILPATRICK TOWNSEND & STOCKTON LLP

Primary Examiner:

Samuel Park

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 24/03 (2013.01);
Abstract

A semiconductor package includes: a first die, a second die and a bonding member arranged between the first and second die, wherein the bonding member is configured to facilitate a bonding between the first and second die and comprises a first area and a second area. The first area is configured with a first set of bonding pads configured to provide electrical connections between the first and second dies. The second area is configured with a second set of bonding pads configured to provide electrical connections between the first and second die, wherein a quantity of bonding pads in the first set is larger than a quantity of bonding pads in the second set. The second area is configured with a dummy structure in one or more spaces where a bonding pad is not present in the second area, the dummy structure not providing an electrical connection.

Find Patent Forward Citations

Chang, Jen-Yuan. (2026). Dummy pattern structure for reducing dishing (U.S. Patent No. 12635502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12635502

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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