The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jan. 10, 2024
Disco Corporation, Tokyo, JP;
Koshiro Suzuki, Tokyo, JP;
Masamitsu Kimura, Tokyo, JP;
Hideji Horita, Tokyo, JP;
Yuya Tanaka, Tokyo, JP;
Takashi Nakahara, Tokyo, JP;
Norihisa Arifuku, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of laying a protective sheet on a face side of a wafer includes preparing a first protective sheet having, on one surface thereof, a non-adhesive portion to be coextensive with a device region of the wafer and an adhesive portion to be positioned along an outer circumferential excessive region of the wafer, affixing the one surface of the first protective sheet to the face side of the wafer, dropping a liquid resin onto a surface of a second protective sheet that has surface irregularities ranging from Ra 0.2 to 7 μm and is free of an adhesive layer, bringing another surface of the first protective sheet into facing relation to the surface of the second protective sheet onto which the liquid resin has been dropped, and curing the liquid resin.