The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Nov. 17, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Hoyoung Kang, Schenectady, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H05B 1/02 (2006.01); H05B 3/12 (2006.01); H05B 3/14 (2006.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0432 (2026.01); H05B 1/0233 (2013.01); H05B 3/12 (2013.01); H05B 3/143 (2013.01); H10P 72/7624 (2026.01);
Abstract
According to an embodiment, an apparatus for a hot plate apparatus is disclosed. The hot plate apparatus includes a housing structure, an alloy, and a heating element. The housing structure includes an outer shell surrounding a cavity. The alloy is disposed of within the cavity. The alloy has a melting temperature range. The heating element is configured to transition the alloy from a solid state to a liquid state at a set temperature between the melting temperature range.