The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jan. 25, 2023
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 54/00 (2026.01); H10P 34/42 (2026.01);
U.S. Cl.
CPC ...
H10P 54/00 (2026.01); H10P 34/42 (2026.01);
Abstract
First edge surface portions and second edge surface portions of first processed grooves and second processed grooves of a wafer are melted by being irradiated with a laser beam. Hence, top surfaces of the first edge surface portions and the second edge surface portions can be planarized, and damage caused to the first edge surface portions and the second edge surface portions can be repaired. As a result, the transverse rupture strength of chips formed by dividing the wafer can be enhanced.