The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Jun. 26, 2023
Applicant:

Stmicroelectronics International N.v., Geneva, CH;

Inventors:

Simone Rascuna, Catania, IT;

Paolo Badala, Acireale, IT;

Gabriele Bellocchi, Catania, IT;

Valeria Puglisi, Catania, IT;

Dario Tenaglia, Gravina di Catania, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/832 (2025.01); H10D 64/01 (2025.01); H10D 64/62 (2025.01); H10D 64/64 (2025.01);
U.S. Cl.
CPC ...
H10D 62/8325 (2025.01); H10D 64/01 (2025.01); H10D 64/62 (2025.01); H10D 64/64 (2025.01);
Abstract

Various embodiments of the present disclosure disclose improved silicon carbide (SiC) power devices and methods of fabrication of such devices. A SiC power device includes a semiconductor base material with a first side and a second side and a first metallic layer disposed on the first side of the semiconductor base material that forms ohmic contacts and Schottky contacts. The SiC power device may be fabricated by forming a first metallic layer on a first side of a semiconductor base material to form a Schottky contact, forming a second metallic layer over the first metallic layer to form a reflective barrier covering the Schottky contact, removing one or more portions of the second metallic layer to expose a first portion of the first metallic layer, and forming silicide portions on the first metallic layer to form ohmic contacts within the Schottky contact.


Find Patent Forward Citations

Loading…