Semiconductor device and method of manufacturing thereof

Abstract

A semiconductor device includes a field effect transistor disposed over a first main surface of a semiconductor substrate, a distributed Bragg reflector disposed over an opposing second main surface of the semiconductor substrate, and a conductive via disposed in the distributed Bragg reflector. The field effect transistor includes a gate structure and a source/drain region. The conductive via passes through the semiconductor substrate and is in direct electrical contact with the source/drain region. A metal silicide is formed in a portion of the source/drain region that is in contact with the conductive via, and thus can reduce contact resistance between the source/drain region and the conductive via. The source/drain region is laser annealed through an opening formed through the distributed Bragg reflector. The distributed Bragg reflector reduces or prevents thermal damage to other regions of the semiconductor device that are protected by the distributed Bragg reflector.