The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Aug. 09, 2023
Applicant:
Marvell Asia Pte Ltd, Singapore, SG;
Inventors:
Hsiu-Che Wang, Oak Park, CA (US);
Dwayne R Shirley, Valley Glen, CA (US);
Roberto Coccioli, Simi Valley, CA (US);
Pushkraj Tumne, Agoura Hills, CA (US);
Assignee:
Marvell Asia Pte Ltd, Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2026.01); H05K 3/3478 (2026.01); H05K 3/3494 (2026.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); H05K 3/3478 (2013.01);
Abstract
A method for fabricating electronic devices includes applying an array of non-uniformly sized spots of solder material on a substrate. An average size of the spots is larger in a center portion of the array than in a peripheral portion of the array. A die is soldered to the substrate using the array.
Wang, Hsiu-Che. (2026). Warpage-resilient attachment of die to substrate in mass reflow soldering (U.S. Patent No. 12635081). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12635081
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile