The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Jul. 24, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sanjeev Baluja, Campbell, CA (US);

Chaowei Wang, San Diego, CA (US);

Kevin Griffin, Livermore, CA (US);

Kenneth Brian Doering, San Jose, CA (US);

Hanhong Chen, Milpitas, CA (US);

Joseph Aubuchon, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32495 (2013.01); H01J 37/3244 (2013.01); H10P 72/0402 (2026.01); H01J 2237/332 (2013.01);
Abstract

Gas distribution assemblies for semiconductor devices are described. The gas distribution assemblies include a backplate, a faceplate, a counterbored hole, and at least one orifice. The at least one orifice includes, for example, at least one straight orifice, or at least two angled orifices. Some embodiments of the gas distribution assemblies provide for reduced plasma damage in a processing chamber. Some embodiments of the gas distribution assemblies provide for reduced jetting on a substrate in a processing chamber. Methods of reducing plasma damage in gas distribution assemblies are also described.


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