The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Dec. 07, 2023
Diodes Incorporated, Plano, TX (US);
Shanghai Kaihong Technology Co., Ltd, Shanghai, CN;
Diodes Technology (Chengdu) Company Limited, Sichuan, CN;
Shanghai Kaihong Electronic Company Limited, Shanghai, CN;
Desen Wang, Chengdu, CN;
Zhigang Feng, Chengdu, CN;
Diodes Incorporated, Plano, TX (US);
Shanghai Kaihong Technology Co., Ltd., Shanghai, CN;
Diodes Technology (Chengdu) Company Limited, Chengdu, CN;
Shanghai Kaihong Electronic Company Limited, Shanghai, CN;
Abstract
A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device. The controller is configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image. A method for detecting foreign objects of a to-be-molded lead frame is also provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile