The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Nov. 18, 2021
Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;

Inventors:

Kenichi Yamagata, Kawasaki, JP;

Takahiro Kondo, Kawasaki, JP;

Hiroaki Takeuchi, Kawasaki, JP;

Hirofumi Imai, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); C07F 5/02 (2006.01); C07F 9/52 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); C07F 5/02 (2013.01); C07F 9/52 (2013.01);
Abstract

A method for producing a hollow package, including forming a side wall on a substrate having an aluminum wire, and forming a top plate portion on the side wall to prepare a hollow structure accommodating the aluminum wire, in which the photosensitive composition that forms the side wall and/or the top plate portion contains an anion represented by General Formula (I1-an) in which A represents a heteroatom, X represents a halogen atom, R represents a monovalent organic group, k represents an integer of 1 to 6, m represents an integer of 0 to 5, n represents an integer of 1 to 3, and m/(k+m) is 0 or greater and less than 0.7.


Find Patent Forward Citations

Yamagata, Kenichi. (2026). Method for producing hollow package and method for providing photosensitive composition (U.S. Patent No. 12631963). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12631963

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…