The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jul. 11, 2023
Denso Corporation, Kariya-city, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Mirise Technologies Corporation, Nisshin, JP;
Hiroaki Fujibayashi, Nisshin, JP;
Hirotaka Mori, Nisshin, JP;
Takayuki Satomura, Nisshin, JP;
Shigeyuki Takagi, Nisshin, JP;
DENSO CORPORATION, Kariya-city, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
MIRISE Technologies Corporation, Nisshin, JP;
Abstract
A semiconductor wafer manufacturing apparatus includes a susceptor. The susceptor has a plate shape having a first surface and a second surface opposite to the first surface, and is disposed on a cylindrical member of a rotating device in such a manner that the first surface faces a reaction chamber and the second surface faces a hollow chamber surrounded by the cylindrical member and the susceptor. The susceptor has a recessed portion for accommodating a base wafer on the first surface, and the recessed portion has such a size that a gap is provided between a side surface of the recessed portion and the base wafer. The recessed portion has a bottom part and has at least one through hole penetrating through the bottom part.