The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Mar. 30, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seungmin Ryu, Hwaseong-si, KR;
Younsoo Kim, Yongin-si, KR;
Jaewoon Kim, Seoul, KR;
Kazuki Harano, Tokyo, JP;
Kazuya Saito, Tokyo, JP;
Takanori Koide, Tokyo, JP;
Yutaro Aoki, Tokyo, JP;
Gyuhee Park, Hwaseong-si, KR;
Younjoung Cho, Hwaseong-si, KR;
Wakana Fuse, Tokyo, JP;
Yoshiki Manabe, Tokyo, JP;
Hiroyuki Uchiuzou, Tokyo, JP;
Masayuki Kimura, Tokyo, JP;
Takahiro Yoshii, Tokyo, JP;
Assignees:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07F 9/00 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); H10B 12/00 (2023.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
C07F 9/005 (2013.01); C23C 16/34 (2013.01); C23C 16/45553 (2013.01); H10B 12/033 (2023.02); H10D 1/692 (2025.01);
Abstract
An organometallic adduct compound and a method of manufacturing an integrated circuit device, the organometallic adduct compound being represented by General Formula (I):