The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Apr. 28, 2022
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Wai Mun Chong, Singapore, SG;

Rakesh Chand, Singapore, SG;

Guofu Zhou, Singapore, SG;

Rohit Pulikkal Kizhakkeyil, Singapore, SG;

Ramachandramurthy Pradeep Yelehanka, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01C 19/5719 (2012.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0051 (2013.01); B81C 1/00341 (2013.01); G01C 19/5719 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/025 (2013.01); B81B 2203/0136 (2013.01); B81B 2207/012 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0178 (2013.01); B81C 2201/019 (2013.01); B81C 2203/0792 (2013.01); G01P 2015/086 (2013.01); G01P 2015/0871 (2013.01);
Abstract

A micro-electro-mechanical system (MEMS) device includes a supporting substrate, a cavity, a stopper, a MEMS structure, and a bonding dielectric layer. The cavity is located at a top surface of the supporting substrate. The stopper is adjacent to the cavity, where a top surface of the stopper and the top surface of the supporting substrate are on the same level in a height. The MEMS structure is disposed on the supporting substrate, where the MEMS structure includes a proof mass and a suspension beam. The proof mass is disposed directly above the stopper, and the suspension beam is disposed directly above the cavity. The bonding dielectric layer is disposed between the top surface of the supporting substrate and a bottom surface of the MEMS structure.


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