The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Apr. 30, 2025
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Ron Zhang, Sunnyvale, CA (US);
Rasit Onur Topaloglu, Poughkeepsie, NY (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, an integrated cooling assembly comprises a semiconductor device and a cold plate attached to a backside of the semiconductor device. The cold plate comprises an upper portion disposed vertically adjacent to the backside of the semiconductor device. The cold plate further comprises a lower portion disposed between the upper portion of the cold plate and the backside of the semiconductor device. The upper portion comprises upper coolant channels defined by upper cavity sidewalls. The lower portion comprises lower coolant channels defined by lower cavity sidewalls.