The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Apr. 27, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yutaka Yamasaki, Koshi, JP;

Takashi Terada, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/18 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H10P 10/00 (2026.01); H10P 72/50 (2026.01); H10P 72/72 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/53 (2026.01); H10P 10/128 (2026.01); H10P 72/72 (2026.01); H10P 72/7612 (2026.01); H10P 72/7618 (2026.01);
Abstract

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.


Find Patent Forward Citations

Quick Actions:

Yamasaki, Yutaka. (2026). Bonding apparatus, bonding system, and bonding method (U.S. Patent No. 12628614). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628614

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…