The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Jul. 25, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Benjamin Colombeau, San Jose, CA (US);

Balasubramanian Pranatharthiharan, San Jose, CA (US);

Lequn Liu, San Jose, CA (US);

Brian K. Kirkpatrick, Allen, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H10D 30/01 (2025.01); H10D 64/01 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10P 72/0421 (2026.01); H10D 30/014 (2025.01); H10D 64/017 (2025.01); H10P 72/0422 (2026.01); H10P 72/0454 (2026.01); H10P 72/0468 (2026.01); H10D 30/6735 (2025.01); H10D 62/121 (2025.01);
Abstract

Semiconductor devices (e.g., GAA device structures) and processing methods and cluster tools for forming GAA device structures are described. The cluster tools for forming GAA device structures comprise a first etch chamber, a second etch chamber, and a third etch chamber. Each of the first etch chamber and the second etch chamber independently comprises a single-wafer chamber or an immersion chamber. One or more of the first etch chamber or the second etch chamber may be a wet etch chamber. In some embodiments, at least one of the first etch chamber, the second etch chamber, and the third etch chamber is a dry etch chamber. The cluster tool described herein advantageously reduces the number of cleaning processes, the total time between cleaning and processing operations, variations in time between processing and variation in sidewall loss compared to conventional cluster tools.


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