The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Mar. 30, 2022
Applicant:

Resonac Corporation, Tokyo, JP;

Inventor:

Kazuma Matsui, Tokyo, JP;

Assignee:

Resonac Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3065 (2006.01); C09K 13/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/3065 (2013.01); C09K 13/08 (2013.01);
Abstract

Provided is an etching method capable of selectively etching an etching object containing silicon nitride as compared with a non-etching object while the generation of particles and a variation in etching rate are suppressed. The etching method includes an etching step of bringing an etching gas containing more than 20% by volume of nitrosyl fluoride into contact with a member to be etched () having an etching object that is to be etched by the etching gas and having a non-etching object that is not to be etched by the etching gas, to selectively etch the etching object as compared with the non-etching object without plasma. The etching object contains silicon nitride.


Find Patent Forward Citations

Matsui, Kazuma. (2026). Etching method and method for producing semiconductor element (U.S. Patent No. 12628591). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628591

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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