The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 20, 2022
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Qin Wang, San Jose, CA (US);

Gang Chen, San Jose, CA (US);

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/805 (2025.01); H10F 39/024 (2025.01); H10F 39/807 (2025.01); H10F 39/8063 (2025.01);
Abstract

A method for preventing defects in a thin film deposited on a semiconductor substrate includes forming a plurality of trenches on a periphery-region of the semiconductor substrate to yield a trenched surface. The semiconductor substrate includes a pixel array; the periphery-region surrounds the pixel array. The trenched surface includes (i) a plurality of trench regions each forming a respective one of the plurality of trenches and (ii) between each pair of adjacent trenches, a respective one of a plurality of inter-trench surfaces. The method also includes depositing the thin film on the surface such that the thin film covers each inter-trench surface and conformally covers each trench region.


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