The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Feb. 24, 2022
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Keishirou Kumada, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/66 (2025.01); H01L 21/22 (2006.01); H10D 12/01 (2025.01); H10D 62/17 (2025.01); H10D 62/53 (2025.01); H10D 62/832 (2025.01); H10D 84/00 (2025.01);
U.S. Cl.
CPC ...
H10D 62/53 (2025.01); H01L 21/221 (2013.01); H10D 12/031 (2025.01); H10D 30/668 (2025.01); H10D 62/393 (2025.01); H10D 62/8325 (2025.01); H10D 84/144 (2025.01);
Abstract

A silicon carbide semiconductor device includes an n-type drift layer disposed on an n-type silicon carbide substrate; an n-type current spreading layer disposed on a top surface of the drift layer, having a higher impurity concentration than the drift layer; a p-type base region disposed on a top surface of the current spreading layer; a p-type gate-bottom protection region located in the current spreading layer; a p-type base-bottom embedded region located in the current spreading layer, separated from the gate-bottom protection region to be in contact with a bottom surface of the base region; an insulated-gate electrode structure disposed in a trench penetrating the base region to reach the gate-bottom protection region, and a lower recombination region disposed in a lower portion of the drift layer, including crystal defects configured to recombine minority carriers injected into the drift layer.


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