The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Apr. 14, 2022
Applicant:

Sicrystal Gmbh, Nuremberg, DE;

Inventors:

Kuniyoshi Okamoto, Kyoto, JP;

Michael Vogel, Nuremberg, DE;

Assignee:

SiCrystal GmbH, Nuremberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); B28D 5/00 (2006.01); B28D 5/04 (2006.01); C30B 29/36 (2006.01); C30B 33/00 (2006.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 62/117 (2025.01); B28D 5/0064 (2013.01); B28D 5/045 (2013.01); C30B 29/36 (2013.01); C30B 33/00 (2013.01); H10D 62/8325 (2025.01);
Abstract

The present invention provides a monocrystalline SiC substrate with an asymmetric shape for enhancing substrate stiffness against thermal induced deformations, the substrate comprising: a main region, and an asymmetric region located at a peripheral region of the substrate and adjacent to the main region, wherein the asymmetric region is inclined inwards, relative to the main region, to provide an asymmetric shape to the substrate. The present invention also provides a method of producing one or more substrates with an asymmetric shape, comprising: performing a multi-wire sawing process in which one or more substrates are cut with an wire-sawing web from an ingot placed on a stage, and cutting the one or more substrates with the asymmetric shape by controlling a relative movement between the wire-sawing web and the stage, the relative movement causing the wire-sawing web to describe a non-linear sawing path across the ingot to cut the asymmetric shape.


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