The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 13, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Chishio Koshimizu, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 72/00 (2026.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32174 (2013.01); H01J 37/3244 (2013.01); H01J 37/32697 (2013.01); H10P 72/0602 (2026.01); H10P 72/722 (2026.01); H01J 37/32642 (2013.01); H01J 2237/002 (2013.01); H01J 2237/24585 (2013.01);
Abstract

The plasma processing apparatus includes a chamber body, a stage, a gas supply mechanism, a DC power supply, a radio-frequency power supply, and a controller. The gas supply is configured to supply a heat transfer gas to the upper surface of the electrostatic chuck. The controller is configured to control the DC power supply. The controller controls the DC power supply to apply, to the electrostatic chuck, a voltage derived by combining an output of a first function that outputs a smaller value as the absolute value of a self-bias voltage generated according to the plasma becomes larger and an output of a second function that outputs a larger value as the pressure of the heat transfer gas supplied to the upper surface of the electrostatic chuck by the gas supply increases.


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