The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Aug. 31, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Masanori Asahara, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32568 (2013.01); H01J 37/32642 (2013.01);
Abstract

In an exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a processing chamber, a substrate support stage. The piezoelectric element is disposed around an opening of the second nozzle to reduce a cross-sectional area of the opening of the second nozzle in accordance with a voltage applied thereto. The thermoelectric element is disposed between the first collection pipe and the second collection pipe to generate an electromotive force corresponding to a temperature difference between the heat transfer medium in the first collection pipe and the heat transfer medium in the second collection pipe. The drive circuit is configured to apply a voltage corresponding to a magnitude of the electromotive force, to the piezoelectric element.


Find Patent Forward Citations

Asahara, Masanori. (2026). Substrate processing apparatus (U.S. Patent No. 12626892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12626892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…