The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Apr. 18, 2024
Applicant:

Winbond Electronics Corp., Taichung City, TW;

Inventors:

Yutaka Ito, Yokohama, JP;

Hitoshi Ikeda, Yokohama, JP;

Assignee:

WINBOND ELECTRONICS CORP., Taichung City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 29/08 (2006.01); G11C 29/56 (2006.01);
U.S. Cl.
CPC ...
G11C 29/08 (2013.01); G11C 29/56008 (2013.01);
Abstract

A semiconductor memory device includes an error bit detection unit and a bit counting unit. The error bit detection unit detects whether each bit in read data and each bit in expected data of the semiconductor memory device are consistent, and outputs the error bit data indicating pass/error information. The pass/error information indicates whether each detected bit is consistent. The bit counting unit counts the number of error bits in the error bit data indicating an inconsistency between the read data and the expected data, or counts the number of pass bits in the error bit data indicating consistency between the read data and the expected data. Furthermore, the semiconductor memory device also includes an interface for a read operation to input external expected values and an interface for the read operation interfaces to output the number of error bits or pass bits instead of the read data.


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