The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Dec. 06, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Srivatsa Madananth, Karnataka, IN;
Dhananjai Kumar, Karnataka, IN;
Yogananda Sarode Vishwanath, Bangalore, IN;
Jacob Andrews, Bangalore, IN;
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); G01H 1/00 (2006.01); H01J 37/32 (2006.01); H10P 72/00 (2026.01); H10P 72/76 (2026.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
C23C 16/4586 (2013.01); G01H 1/00 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01J 37/32825 (2013.01); H10P 72/0421 (2026.01); H10P 72/0432 (2026.01); H10P 72/0602 (2026.01); H10P 72/0604 (2026.01); H10P 72/7624 (2026.01); H01J 2237/002 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/3341 (2013.01); H10P 72/72 (2026.01);
Abstract
Exemplary semiconductor processing chambers may include a chamber body defining a substrate processing region. The chambers may include a substrate support positioned within the substrate processing region. The substrate support may include a ceramic or polymeric insulator plate positioned between a cathode assembly and an electrostatic chuck assembly. The chambers may include an acoustic emission probe in contact with the insulator plate of the substrate support.